Advancing the Texas Advanced Packaging Ecosystem

This event is co-hosted with the Texas Institute for Electronics onsite at The University of Texas at Austin. 

The CSIS Renewing American Innovation program and the Texas Institute for Electronics (TIE) at The University of Texas at Austin are hosting a half-day symposium of expert panels highlighting the region’s dynamism and how the private sector, public sector, and academia in Austin and the state of Texas more generally have made the state a world-renowned semiconductor advanced packaging hub. 

Texas is a major semiconductor technology hub, specifically in advanced packaging, which sits at the intersection of economic competition and national security. The Texas innovation ecosystem as a whole – the statewide semiconductor strategy, the depth of industry across fabs, design centers, defense organizations, and equipment firms - are supported by a state policy infrastructure that provides enabling conditions which no other state had replicated at such scale.

This event is made possible through general support to CSIS.